The increasing demand for high-performance, low-power, and compact systems in nanoelectronics has driven the development of 3D heterogeneous integration. The evolution of semiconductor packaging has a profound impact on automotive, aerospace, and medical devices. The process involves stacking multiple layers of chips, each with different functions. This approach allows for higher integration density, reduced power consumption, and improved performance compared to traditional 2D integration. This article discusses the evolution of semiconductor packaging.

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G. Kenyon, “ Heterogeneous Integration and IC Packaging ,” EE Times Europe , Apr. 06, 2021. https://www.eetimes.eu/heterogeneous-integration-and-the-evolution-of-ic-packaging/ (accessed Apr. 11, 2023).